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Updated on February 24, 2021 4:37 pm
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Updated on February 24, 2021 4:37 pm
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Updated on February 24, 2021 4:37 pm

Qualcomm’s new 3D Sonic sensor captures 1.7 times more biometric data than its predecessor

MADRID, 12 Jan (Portaltic / EP) –

Qualcomm has presented the second generation of its 3D Sonic fingerprint sensor, larger and faster than its predecessor, and with the capacity to capture more biometric data.

The 3D Sonic sensor uses ultrasonic waves to scan users’ fingerprints from its location under the screen of a ‘smartphone’, even if the fingers are wet. It is a technology currently present in devices such as Samsung Galaxy S10, Note10, S20 and Note20 series.

The new generation improves scanning speed and data capture on a chip 77 percent larger than the previous generation. It is also “ultra-thin”, as the company has described it, which will allow its use in devices with flexible screens.

As Qualcomm explained, 3D Sonic Sensor Gen 2 is 8 x 8mm in size, allowing it to cover a larger surface area and capture 1.7 times more biometric data than the previous generation. It is also 50 percent faster.

The new generation of the 3D Sonic sensor will debut with mobile devices that hit the market in early 2021.

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